Software / Graphics & Design →ANSYS Products 17.0.2
ANSYS, Inc. has released update of its leading engineering simulation solution, ANSYS 17.0, is offers advanced functionality enabling engineers to rapidly innovate new products.
Engineers across disciplines – from structures to fluids to electromagnetics to systems – will realize step-change improvements in the way they develop products using the newly released ANSYS 17.0. This next generation of ANSYS industry-leading engineering simulation solutions set the scene for the next quantum leaps in product development, enabling unprecedented advancements across an array of industry initiatives from smart devices to autonomous vehicles to more energy-efficient machines. The most feature-rich release in the company's 45-year history, available today, delivers 10x improvements to product development productivity, insight and performance.
Simulation has been identified as one of the key pillars of the next industrial revolution, known as Industry 4.0. With the advent of the Internet of Things all products are getting smarter, new advanced materials are enabling lighter, stronger and more sustainable designs, and additive manufacturing enables users to 3-D print anything they can imagine. Unlocking the power of these trends is impossible without simulation tools' ability to virtually explore these vastly increased options to arrive at the winning designs of tomorrow.
Highlights of the release include:
10x Improvements to Productivity.
ANSYS 17.0 delivers solutions faster so engineers and designers can make more informed decisions sooner in the product development cycle. That enables organizations to rapidly innovate and bring products to market faster, while getting more productivity from their existing engineering assets.
Through tighter integration of semiconductor and electronics simulation solutions, ANSYS 17.0 delivers a comprehensive chip-package-system design workflow. New capabilities for automated thermal analysis and integrated structural analysis deliver an unequalled chip-aware and system-aware simulation solution, enabling customers to deliver smaller, higher-power density devices to market faster. With the advent of the Internet of Things, more products and engineers will rely on these capabilities.
In the fluids suite, ANSYS continues its technology leadership with breakthrough advancements in physics modeling and introduces new innovations across the entire workflow and user environment design to accelerate time to results by up to 85 percent without compromising accuracy. Improvements to workflow and meshing enable novice users to quickly become productive while new tools and options expand the application reach for experienced users.
Preprocessing – or the act of setting up simulations – with ANSYS 17.0 has also improved by an order of magnitude. Using the direct modeling tools in ANSYS 17.0, users can prepare their geometry for analysis faster than traditional computer-aided design (CAD). Save and load times for complex models, as well as the performance for common geometry editing functions has increased by up to 100 times. ANSYS 17.0 geometry tools also boast tighter integration to ANSYS Workbench and offer many productivity advancements for modeling fabricated and composite structures. Fluids pre-processing for complex systems has also improved dramatically. The process of preparing and meshing models with hundreds of parts has been reduced from days to hours with ANSYS 17.0.
ANSYS 17.0 enables software engineers to be more productive with developing, testing and certifying embedded software. New industry-specific vertical solutions take full benefit from the openness and flexibility of the platform to facilitate interactions with original equipment manufacturers and suppliers while adhering to such industry standards as ARINC 661/664, FACE and AUTOSAR.
10x Improvements for Deeper Insight.
ANSYS 17.0 delivers deeper insight into real-world product performance through such enhancements as higher fidelity simulations and better post processing. For example, with printed circuit boards, engineers can now quickly import ECAD geometry and perform coupled thermal-structural analysis with power integrity and electronics cooling analyses to accurately predict stress, deformation and fatigue. These capabilities enable engineers to design board layouts and thermal management strategies for more reliable electronic components. As a result, complex board and packages can be set up and solved in minutes, not hours or days.
As products become more complex, the ability to simulate entire systems provides a significant advantage to manufacturers. Using a single simulation platform at ANSYS 17.0, engineers can not only simulate physical models but can also consider embedded systems design and embedded software models. This enables virtual systems simulation, testing and prototyping, reducing product development time and cost. In this release, ANSYS introduces native support for the industry-standard system modeling language, Modelica, which enables access to hundreds of additional mechanical and fluid component models in addition to its rich model library for power electronics. At the same time, advancements in the platform provide more insight to real world system performance by enabling high-fidelity 3-D results to be incorporated into system-level models.
ANSYS 17.0 greatly expands turbomachinery simulation capabilities across a broad spectrum to produce highly accurate results, across a wider array of operating conditions and with shorter turnaround time. Engineers can solve considerably more transient blade row configurations by calculating as few as one blade per row instead of the full wheel to speed time to solution by over 10x and drastically reducing the required computing resources. These advances are critical given that turbines produce 99 percent of the world's electricity.
10x Improvements to Performance.
ANSYS 17.0 delivers performance improvements for all of its product lines, particularly in the realm of high-performance computing (HPC). ANSYS 17.0 introduces the most modern HPC solver architectures that leverages the latest processor technologies. Organizations can leverage this power on most IT configurations – from desktops to cloud environments – to obtain their simulation results sooner.
There is a clear global demand to develop more power efficient machines, but progress has been hindered due to the huge computational resources required to simulate an electric machine. Complete transient electromagnetic field analysis of an electric machine can require two weeks or more to complete. HPC advances in the ANSYS 17.0 electromagnetics suite deliver unprecedented computational speed for full transient electromagnetic field simulation for electric motor design. Simulations of critical transient behaviors that previously required weeks of computational time can now be completed in hours during early design stages, reducing the risk of project delays and late-stage design changes.
As previously announced, ANSYS fluids solutions have smashed the previous simulation world record by scaling to 129,000 compute cores running at 90 percent efficiency – a 10x improvement over the past two years. HPC performance of the structures suite has also improved significantly and now demonstrates scaling up to 1000 cores. Structural simulations which required running overnight, can now be completed in an hour, enabling engineers to explore 10x more variations and find the best design faster.
ANSYS_V17.0_WIN64_PDF_DOCS.iso (updated: 04.2016)
Warning: To install and to use it you need ANSYS Products 17.0 Win64 with SSQ's crack to be preinstalled
About ANSYS, Inc.
ANSYS is the global leader in engineering simulation. We bring clarity and insight to our customer's most complex design challenges through the broadest portfolio of fast, accurate and reliable simulation tools. Our technology enables organizations in all industries to imagine high-quality, innovative product designs that are sustainable and have an accelerated time to market. Founded in 1970, ANSYS employs almost 3000 professionals, more than 700 of them with PhDs in engineering fields such as finite element analysis, computational fluid dynamics, electronics and electromagnetics, embedded software, system simulation and design optimization. Headquartered south of Pittsburgh, U.S.A., ANSYS has more than 75 strategic sales and development locations throughout the world with a network of channel partners in 40+ countries.
Name: ANSYS Products
Version: (64bit) 17.0.2
OS: Windows 7even / 8 / 10
Size: 9.0 Gb
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